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US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on June 23 for "Method for manufacturing semiconductor device and semiconductor device" (Chinese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,952, issued on June 23, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Method for manufacturing semiconductor devi... Read More


US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on June 23 for "Three-dimensional memory devices and methods for forming the same" (Chinese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,953, issued on June 23, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Three-dimensional memory devices and methods ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Semiconductor device including variable resistance pattern and electronic system including the semiconductor device" (South Korean Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,954, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device including variable resi... Read More


US Patent Issued to NANYA TECHNOLOGY on June 23 for "Semiconductor device with filling layer and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,955, issued on June 23, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with filling layer and meth... Read More


US Patent Issued to Intel on June 23 for "Incorporation of superlattice semi-metals for scaled interconnects" (Oregon Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,956, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.). "Incorporation of superlattice semi-metals for scaled interconne... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Anti-fuse cells with backside power rails" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,957, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Anti-fuse cells with backside power... Read More


US Patent Issued to International Business Machines on June 23 for "Flexible wiring architecture for multi-die integration" (New York Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,958, issued on June 23, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Flexible wiring architecture for multi-die i... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Method for forming semiconductor structure including capacitor" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,959, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method for forming semiconducto... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Metal-insulator-silicide capacitors" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,960, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Metal-insulator-silicide capacitors... Read More


US Patent Issued to GLOBALFOUNDRIES U.S. on June 23 for "Heater elements" (Vermont Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,961, issued on June 23, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.). "Heater elements" was invented by Uppili S. Raghunathan (E... Read More